Rigid-flex Board Fabrication

Flex/Rigid-Flex, Fabrication

Career Technologies offers a wide variety of manufacturing capabilities:
  • Trace / Space 37um (1.5 mil)
  • Micro / Vias Min 50u (2 mil)
  • Blind/Buried Vias (2mil)
  • Laser- Precision Drilling / Excising<50um (2mil)
  • Layer Count Capability 1-10+
  • Unsupported Traces / Cantilever Leads
  • Controlled Impedance Routing Capabilities
  • Liquid Soldermask Thickness 25um (1mil)
  • Photo Imageable Coverlay Min 25um (1mil)
  • RoHS & Non RoHS PCB/Flex Circuit Manufacturing
  • Automated Optical Inspection (AOI)
  • Electrical Testing (Flying Probe, Function, and Hi-Pot)
  • Tab Ability to Test for 10-15 Resistance Leakage

Contact us to discuss your project

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