Rigid-flex Board Fabrication
Flex/Rigid-Flex, Fabrication
Career Technologies offers a wide variety of manufacturing capabilities:
- Trace / Space 37um (1.5 mil)
- Micro / Vias Min 50u (2 mil)
- Blind/Buried Vias (2mil)
- Laser- Precision Drilling / Excising<50um (2mil)
- Layer Count Capability 1-10+
- Unsupported Traces / Cantilever Leads
- Controlled Impedance Routing Capabilities
- Liquid Soldermask Thickness 25um (1mil)
- Photo Imageable Coverlay Min 25um (1mil)
- RoHS & Non RoHS PCB/Flex Circuit Manufacturing
- Automated Optical Inspection (AOI)
- Electrical Testing (Flying Probe, Function, and Hi-Pot)
- Tab Ability to Test for 10-15 Resistance Leakage
Contact us to discuss your project
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