Conformal Coating, Underfill, and Potting Solutions
Conformal Coating, Underfill, and Potting Solutions
Career technologies also offers protective coatings that are required in electronic circuit assemblies.
Conformal Coating – Applied to electronic circuit assemblies. Protects against moisture, dust, chemicals, and temperature extremes.
Underfilling Encapsulation – protects in flip-chip packaging, reduces stress on solder bumps of chips, and protects against moisture, ionic contaminants, thermal vibration and shock.
Potting Materials – Protects the electronic assembly against vibration/shock, corrosion, and chemicals. Also provides electrical insulation, enhanced mechanical strength and heat dissipation.
Contact us to discuss your project
Need help? Want to learn more, or have questions? Get in touch!