Conformal Coating, Underfill, and Potting Solutions
Career technologies also offers protective coatings that are required in electronic circuit assemblies.
- Conformal Coating – Applied to electronic circuit assemblies. Protects against moisture, dust, chemicals, and temperature extremes.
- Underfilling Encapsulation – protects in flip-chip packaging, reduces stress on solder bumps of chips, and protects against moisture, ionic contaminants, thermal vibration and shock.
- Potting Materials – Protects the electronic assembly against vibration/shock, corrosion, and chemicals. Also provides electrical insulation, enhanced mechanical strength and heat dissipation.
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